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August 7th, 2011
05:27 pm - Insight for soldering problem
Last night i awoke in the middle of the night with a solution to one of my current soldering problems: the inlay. It is pretty much impossible to place solder chips along the length of metal, since the flux bubbles them off when heated; it is a PITA to bend them and insert them in the seam so they're positioned and kinda stuck when the heat hits.
So: this is a job for stick-soldering! meaning, heat the thing up to soldering temp then apply solder to the seam- it'll melt and flow into the spaces, just like one wants it to. It might be less likely to solder the damn binding wire into the mix, too.
For my second experimental piece, I'm going to bind everything together and then stick-solder it; the stick-soldering worked great for the gaps that were left on my previous attempt.
Current Mood:  pleased
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Thanks for the suggestions!
Yes, a less bubbly flux would be easier- but right now I'm doing prototypes in copper and silver, so I need a pretty sturdy flux. Once i get to gold, of course... well, I'll have to revisit everything. Sigh.
Of course, that's only if the prototypes actually WORK, and they may well not- which is why I'm using copper and silver here. :)
Balls are great, and I use them a lot! but for this one- the stick soldering seems to be effective, even though it's rather a "cowboy" technique- and one I almost never use, which is why it took me so long to think of it! |
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